S, SN, R, C, CH, D, DH, H – TYPICAL PRODUCT SERIES AVAILABLE

 

“S” - SERIES, “STANDARD”

High performance thermoelectric modules for traditional cooling applications (refrigeration, electronics, industrial, automotive)

•• Maximum temperature for short time (to mount a module into unit): 130°С

•• Recommended operation temperature: up to 120°С

•• Max ΔT up to 75°С (at Thot=25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Recommended operation current: 0.7 of Imax

•• Recommended operation voltage: 0.8 of Umax

•• Wires: UL-1569 in PVC insulation

 

“R” - SERIES, “RELIANCE”

High performance for traditional cooling applications (refrigeration, electronics, industrial, automotive)

•• Maximum temperature for short time (to mount a module into unit): 120°С

•• Recommended operating temperature: up to 90°С

•• Max ΔT: up to 75°С (at Thot= 25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80 °С power cycling mode: over 25 000 cycles

•• Recommended operation current: 0.7 of Imax

•• Recommended operation voltage: 0.8 of Umax

•• Wires: UL-1569 in PVC insulation

 

“C” - SERIES, “CYCLE”

Thermoelectric modules, designed for applications that imply long-term cycling stability with the change of polarity of electric current (lasers, thermal stabilization device test stands chip production, etc.).

•• Maximum temperature for short time (to mount a module into unit): 130°С

•• Recommended operating temperature: up to 120°С

•• Recommended operation current: 0.7 of Imax.

•• Max ΔT: up to 75K (at Thot= 25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80 °С power cycling mode: up to 25 000 cycles

 

“H” – SERIES, “HOT”

Thermoelectric modules, designed for applications requiring high efficiency unit at operating temperature, not exceeding 150 ° C. Possible to use in the long-term heating mode.

•• Maximum temperature for short time (to mount a module into unit): 200 °С

•• Recommended operation temperature: up to 150 °С

•• Max ΔT up to 75K (at Thot=25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Modules of this series pass additional annealing at 150°С

•• Recommended operation current: 0.7 of Imax

 

“D” - SERIES, HIGH POWER DENSITY MODULES (“HPDM”)

Modules, designed for applications requiring high performance modules where the devices (lasers, thermal stabilization of test bench device for chip production, etc.) produce a large amount of heat that needs to be removed constantly or in a short time.

•• Maximum temperature for short time (to mount a module into unit): 130°С

•• Recommended operating temperature: up to 120 °С

•• Recommended operation current: 0.5 – 0.7 of Imax.

•• Minimal cycling stability in ON-OFF power mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80 °С power cycling mode: up to 25 000 cycles

•• Recommended operating temperature not higher than 90 °С

•• At operating current (I) close to 0,5 from Imax these modules provide COP, close to 1.

 

“SN” - SERIES, “STANDARD - 232”

High performance thermoelectric modules for traditional cooling applications (refrigeration, electronics, industrial, automotive)

•• Maximum temperature to mount a module into unit: 180 °С

•• Recommended operation temperature: up to 120 °С

•• Max ΔT up to 75°С (at Thot =25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Recommended operation current: 0.7 of Imax

•• Recommended operation voltage: 0.8 of Umax

•• Series is assembled on solder with melting point 232 °С

 

“CH” - SERIES, “CYCLE + HOT”

Modules, designed for applications that imply long-term cycling stability with the change of polarity of electric current. (lasers, thermal stabilization of test bench device for chip production, etc.).

•• Maximum temperature to mount a module into unit: 200 °С

•• Recommended operating temperature: up to 150°С

•• Recommended operation current: 0.7 of Imax.

•• Max ΔT: up to 75K (at Thot= 25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80 °С power cycling mode: up to 25 000 cycles

 

“DH” - SERIES, HIGH POWER DENSITY MODULES, “HPDM + HOT"

Thermoelectric modules, designed for applications requiring high performance modules where the devices (lasers, thermal stabilization of test bench device for chip production, etc.) produce a large amount of heat per square.

•• Maximum temperature for short time (to mount a module into unit): 200°С

•• Maximum operation temperature: 150°С

•• Recommended operation current: 0.5 – 0.7 of Imax.

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80 °С power cycling mode: over 25 000 cycles

 

OPTIONS FOR SURFACES FINISH:

 

L1 – height tolerance ± 0.01 mm

L2 – height tolerance ± 0.02 mm

R – round shape of the module

H – module has a circular hole in the ceramics

Mch – both sides have metallization (height tolerance ±0.15)

Mc – only cold side has metallization (height tolerance ±0.15)

Mh – only hot side has metallization (height tolerance ±0.15)

TchX – both sides have tinning, height tolerance before tinning ±0.15

TcX – only cold side has tinning, height tolerance before tinning ±0.15

ThX – only hot side has tinning, height tolerance before tinning ±0.15

X – type of solder used for tinning: 1 – solder with melting temperature 117 °С ,

                                                       2 – solder with melting temperature 138 °С.

No code – module is not lapped, without metallization or tinning

 

SEALING TYPE

S – silicon sealing;

E – epoxy sealing;

Absence of sealing index means modules without sealing.

 

NOTE! MAX ΔT IS REDUCED BY 2-3°С FOR SILICONE AND BY 1-2°С FOR EPOXY SEALING VERSIONS.

 

THE MODULES CAN BE ASSEMBLED IN KITS WITH SERIES OR PARALLEL CONNECTION OR INSTALLED IN A DEVICE FOLLOWING CUSTOMER’S DESIGN & CONSTRUCTION DOCUMENTATION